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GL-266P-70-2.9 Datasheet et spécifications

Fabricant : National Semiconductor 

Emballage : PGA 

Pins : 320 

Température : Min 0 °C | Max 0 °C

Taille : 4504 KB

Application : Geode Processor Integrated x86 Solution with MMX Support 

GL-266P-70-2.9 PDF Download

GL-266P-70-2.9 PDF